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Société
MerckLieu(x)
Auvergne-Rhône-AlpesHead of Metrology et Inspection (m/f/d), Montbonnot Saint-Martin
CDI
Industrie Pharmaceutique
Cadre
Ingénieur
Ingénieur
Publiée depuis 1 jour
Merck
Merck - avec plus de 300 ans de progrès et plus de 38000 employés dans le monde, se positionne en leader sur le marché Pharmaceutique, Chimique, et des Sciences de la vie. Avec passion, engagement et innovation, nous poursuivons un objectif commun : améliorer la qualité de vie. C'est pourquoi nous avons besoin de vous!
Tasks
- The Head of Metrology & Inspection (f/m/d) will lead the overall strategy, growth, and operational execution of the company’s metrology and inspection business focused on advanced semiconductor packaging market segments. This role is accountable for P&L ownership, technology roadmap alignment, and customer engagement with leading IDMs and OSATs, ensuring competitive positioning in high-growth areas such as 2.5D/3D integration, wafer-level and panel-level packaging, and hybrid bonding.
- Full P&L ownership with strategic growth planning for advanced packaging metrology and inspection.
- Drive revenue growth and gross margin optimization through pricing, product mix, and cost control.
- Build strong customer relationships and pursue new opportunities in AI/HPC packaging, chiplet integration, and HBM metrology.
- Oversee product roadmaps, manufacturing, supply chain, and field service to ensure delivery, efficiency, and uptime.
- Lead global sales, channel strategies, pricing models, and expand recurring revenue streams.
- Build and lead a high-performing cross-functional team while developing leadership and fostering a customer-focused culture.
Profile
- Over 15 years of experience in the semiconductor equipment industry.
- Expertise in metrology and inspection systems.
- In-depth knowledge of advanced packaging architectures (CoWoS, fan-out, hybrid bonding, PLP).
- Proven track record managing P&L and business units exceeding $100M.
- Strong technical understanding of optical inspection and metrology technologies.
- Familiar with key packaging challenges: warpage, overlay, bump/TSV defects, voids.
- Well-connected with leading customers and industry ecosystem.
- Strategic thinker with strong execution skills and commercial deal-making experience.
- Comfortable operating at both boardroom and customer fab le
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