Head of Metrology et Inspection (m/f/d), Montbonnot Saint-Martin

Our passion for science and technology drives our approximately 62,000 employees in 65 countries to address some of today’s toughest challenges and develop more sustainable ways of living.

In our rapidly changing and uncertain world, factors such as an aging population, chronic diseases, AI, climate change, and other megatrends have created an appetite for scientific breakthroughs that can make a positive difference across our global society. The pace of change will increase over coming decades as technologies evolve and converge in ways that fundamentally transform how we live and work. For us at Merck, change is not a threat but an opportunity as we have proven for over more than 350 years.

Tasks

• The Head of Metrology & Inspection (f/m/d) will lead the overall strategy, growth, and operational execution of the company’s metrology and inspection business focused on advanced semiconductor packaging market segments. This role is accountable for P&L ownership, technology roadmap alignment, and customer engagement with leading IDMs and OSATs, ensuring competitive positioning in high-growth areas such as 2.5D/3D integration, wafer-level and panel-level packaging, and hybrid bonding.
• Full P&L ownership with strategic growth planning for advanced packaging metrology and inspection.
• Drive revenue growth and gross margin optimization through pricing, product mix, and cost control.
• Build strong customer relationships and pursue new opportunities in AI/HPC packaging, chiplet integration, and HBM metrology.
• Oversee product roadmaps, manufacturing, supply chain, and field service to ensure delivery, efficiency, and uptime.
• Lead global sales, channel strategies, pricing models, and expand recurring revenue streams.
• Build and lead a high-performing cross-functional team while developing leadership and fostering a customer-focused culture.

Profile

• Over 15 years of experience in the semiconductor equipment industry.
• Expertise in metrology and inspection systems.
• In-depth knowledge of advanced packaging architectures (CoWoS, fan-out, hybrid bonding, PLP).
• Proven track record managing P&L and business units exceeding $100M.
• Strong technical understanding of optical inspection and metrology technologies.
• Familiar with key packaging challenges: warpage, overlay, bump/TSV defects, voids.
• Well-connected with leading customers and industry ecosystem.
• Strategic thinker with strong execution skills and commercial deal-making experience.
• Comfortable operating at both boardroom and customer fab le